Conductor: 24 AWG (0.5 mm) Solid Annealed Bare Copper Insulation: Solid Polyolefin Filling Compound: 80°C ETPR (extended thermoplastic rubber) Core covering: non-hygroscopic dielectric tape, electrically continuous 0.008 in (0.2 mm) polymer coated corrugated aluminum tape, applied with an overlap, black polyethylene outer jacket Metallic shield tapes Fully filled constructions Transmission performance to 100MHz Extends the LAN to entire campus Helps prevent intrusion of moisture Facilitates grounding according to NEC Conductors: 1/0.5mm dia solid tinned copper Insulation: PVC 0.95mm dia Jacket: LZSH (Black) Moisture barrier: Aluminium Polyethylene Taped